Thermal Management of Electronic Systems -

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Résumé :
The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera? tures of critical electronic parts with the required accuracy. He or she? had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea? sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.

Sommaire:
1. Invited Lectures.- Thermal management of air-cooled electronic systems: New challenges for research.- Analysis and prevention of thermally induced failures in electronic equipment.- 2. Numerical and Experimental Analysis of Systems.- Computational analysis of air and heat flow in electronic systems.- Thermal analysis of a telecommunications rack system.- Supporting experiments for CFD based thermal design of telecommunication equipment.- Two complementary approaches for the thermal simulation of electronic equipment.- Some considerations on practical formulas used for thermal design of natural ventilated enclosures.- 3. Numerical and Experimental Analysis of Channels.- Natural convection in a rectangular enclosure with an array of chips mounted on a vertical wall.- Differences between 2D and 3D models predictions in a channel with a dissipating obstacle.- Effect of radiation on natural convection in tilted channels.- 4. Numerical and Experimental Analysis of Electronic Parts.- Thermal study of a laser diode using a finite element method associated with a meshing superimposition method.- Computer-aided optimization of electrothermal CMOS-compatible infrared sensors.- Mixed convection and heat transfer on vertical parallel printed circuit boards.- A parametric study of heat spreading through multiple layer substrates.- Thermal drift effects in power microwave hybrid circuits.- Computational modelling of wafer cooldown in a staging module.- 5. Measurement Techniques.- Recent innovations in thermal technology instrumentation applied to materials used in electronic applications.- An experimental method to determine the effective thermal conductivity of printed circuit boards.- Air velocity and temperature measurements around a naturally convecting rectangular fin array.-6. Liquid Cooling of Electronic Devices.- Application and performance of Si-microcooling systems for electronic devices.- Temperature controlled measurements of the critical heat flux on microelectronic heat sources in natural convection and jet impingement cooling.- Pool boiling heat transfer of dielectric fluids for immersion electronic cooling: effects of pressure.- 7. Thermal Characterization of Electronic Parts.- Thermal design of a 419 pins ceramic Pin Grid Array package.- Design of an optimal heat-sink geometry for forced convection air cooling of multi-chip modules.- Thermal characterization and design for high performance multichip module type laminate.- The thermal characteristics of a board-mounted 160 lead plastic quad flat pack.- Investigation of die attach integrity using transient thermal analysis techniques.- 8. Thermal Stress and Die Attach Defects.- Thermal stress in convectively-cooled plastic-encapsulated chip packages.- Impact of die attach defects on internal temperature of power hybrids.- Author Index.