Recent Progress in Lead-Free Solder Technology -

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Résumé :
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials' development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder....

Sommaire:
Recent Studies in The Development of Ceramic Reinforced Lead-Free Composite Solder.- Development of Geopolymer Ceramic Reinforced Solder.- Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders.- Molecular Dynamic on the Nanoparticle Reinforcement into Lead-free Solder during Reflow Soldering Process.- Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics.- Advanced assembly of Miniaturized Surface Mount Technology Components using Nano-Reinforced Solder Paste.- Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi.- The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation & Experimental.- Flux Modification for Wettability and Reliability Improvement in Solder Joints.- Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints.- Significance of Interfacial Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint and Methods of IMC Layer Thickness Measurements.- The Effect of Laser Soldering onto Intermetallic Compound Formation and Growth.- Reliability Analysis on the Flexible Printed Circuit Board During Reflow Soldering.- Solder Paste's Rheology Data for Stencil Printing Numerical Investigations.- Tin Whiskers Growth in Electronic Assemblies