Thermal Design - Hosung Lee

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Auteur(s) : Hosung Lee

Editeur : John Wiley & Sons Inc

Langue : Anglais

Parution : 01/06/2022

Format : Moyen, de 350g à 1kg

Nombre de pages : 928

Expédition : 1832

Dimensions : 18.9 x 26.4 x 56.0

ISBN : 9781119685975

Résumé :
Thermal Design

Discover a new window to thermal engineering and thermodynamics through the study of thermal design

Thermal engineering is a specialized sub-discipline of mechanical engineering that focuses on the movement and transfer of heat energy between two mediums or altered into other forms of energy. Thermal engineers must have a strong knowledge of thermodynamics and the processes that convert generated energy from thermal sources into chemical, mechanical, or electrical energy - as such, thermal engineers can be employed in many industries, particularly in automotive manufacturing, commercial construction, and the HVAC industry. As part of their job, thermal engineers often have to improve a current system to make it more efficient, and so must be aware of a wide array of variables and familiar with a broad sweep of systems to ensure the work they do is economically viable.

In this significantly updated new edition, Thermal Design details the physical mechanisms of standard thermal devices while integrating essential formulas and detailed derivations to give a practical understanding of the field to students. The textbook examines the design of thermal devices through mathematical modeling, graphical optimization, and occasionally computational-fluid-dynamic (CFD) simulation. Moreover, it presents information on significant thermal devices such as heat sinks, thermoelectric generators and coolers, heat pipes, and heat exchangers as design components in larger systems - all of which are increasingly important and fundamental to numerous fields such as microelectronic cooling, green or thermal energy conversion, and thermal control and management in space.

Readers of the Second Edition of Thermal Design will also find:

• A new chapter on thermoelectrics that reflects the latest modern technology that has recently been developed
• More problems and examples to help clarify points throughout the book
• A range of appendices, including new additions, that include more specifics on topicscovered in the book, tutorials for applications, and computational work
• A solutions manual provided on a companion website

Thermal Design is a useful reference for engineers and researchers in me chanical engineering, as well as senior undergraduate and graduate students in mechanical engineering....

Biographie:

HoSung Lee, PhD at the University of Michigan, Ann Arbor in 1993,?is Emeritus Professor in the department of Mechanical and Aerospace Engineering at Western Michigan University, USA. His other areas of research include optimal design of thermoelectric generators and coolers and thermoelectric materials.

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Sommaire:

Preface to the Second Edition xix

Preface to the First Edition xxi

About the Companion Website xxv

1 Introduction 1

1.1 Introduction 1

1.2 Humans and Energy 1

1.3 Thermodynamics 2

1.3.1 Energy, Heat, and Work 2

1.3.2 The First Law of Thermodynamics 2

1.3.3 Heat Engines, Refrigerators, and Heat Pumps 5

1.3.4 The Second Law of Thermodynamics 7

1.3.5 Carnot Cycle 7

1.4 Heat Transfer 11

1.4.1 Introduction 11

1.4.2 Conduction 12

1.4.3 Convection 15

1.4.3.1 Parallel Flow on an Isothermal Plate 16

1.4.3.2 A Cylinder in Cross Flow 18

1.4.3.3 Flow in Ducts 20

1.4.3.4 Free Convection 25

1.4.4 Radiation 29

1.4.4.1 Thermal Radiation 29

1.4.4.2 View Factor 34

1.4.4.3 Radiation Exchange Between Diffuse-Gray Surfaces 34

Problems 38

References 42

2 Heat Sinks 45

2.1 Longitudinal Fin of Rectangular Profile 45

2.2 Heat Transfer from Fin 47

2.3 Fin Effectiveness 48

2.4 Fin Efficiency 48

2.5 Corrected Profile Length 49

2.6 Optimizations 49

2.6.1 Constant Profile Area A p 49

2.6.2 Constant Heat Transfer from a Fin 52

2.6.3 Constant Fin Volume or Mass 53

2.6.4 Optimum Dimensions of Rectangular Fin 55

2.6.5 Radial Fins 60

2.6.6 Optimization of Radial Fins 63

2.7 Plate Fin Heat Sinks 68

2.7.1 Free (Natural) Convection Cooling 68

2.7.1.1 Small Spacing Channel 68

2.7.1.2 Large Spacing Channel 71

2.7.1.3 Optimum Fin Spacing 71

2.7.2 Forced Convection Cooling 72

2.7.2.1 Small Spacing Channel 73

2.7.2.2 Large Spacing Channel 74

2.8 Multiple Fin Array Ii 75

2.8.1 Natural (Free) Convection Cooling 77

2.9 Thermal Resistance and Overall Surface Efficiency 78

2.10 Fin Design with Thermal Radiation 97

2.10.1 Single Longitudinal Fin with Radiation 97

Problems 109

Computer Assignments 116

Project 116

References 117

3 Heat Pipes 119

3.1 Operation of Heat Pipe 119

3.2 Surface Tension 120

3.3 Heat Transfer Limitations 122

3.3.1 Capillary Limitation 123

3.3.1.1 Maximum Capillary Pressure Difference 123

3.3.1.2 Vapor Pressure Drop 125

3.3.1.3 Liquid Pressure Drop 127

3.3.1.4 Normal Hydrostatic Pressure Drop 127

3.3.1.5 Axial Hydrostatic Pressure Drop 128

3.3.2 Approximation for Capillary Pressure Difference 128

3.3.3 Sonic Limitation 128

3.3.4 Entrainment Limitation 129

3.3.5 Boiling Limitation 129

3.3.6 Viscous Limitation 130

3.3.6.1 Summary of Heat Transport Limits 134

3.3.6.2 Effective Thermal Conductivity 135

3.4 Heat Pipe Thermal Resistance 136

3.4.1 Contact Resistance 138

3.5 Variable Conductance Heat Pipes (VCHP) 141

3.5.1 Gas-Loaded Heat Pipes 141

3.5.2 Clayepyron-Clausius Equation 143

3.5.3 Applications 144

3.6 Loop Heat Pipes 146

3.7 Micro Heat Pipes 148

3.7.1 Steady-State Models 148

3.7.1.1 Conventional Model 148

3.7.1.2 Cotter's Model 150

3.8 Working Fluid 154

3.8.1 Figure of Merit 154

3.8.2 Compatibility 156

3.9 Wick Structures 157

3.10 Design Example 158

3.10.1 Selection of Material and Working Fluid 158

3.10.2 Working Fluid Properties 159

3.10.2.1 Estimation of Vapor Space Radius 159

3.10.3 Estimation of Operating Limits 159

3.10.3.1 Capillary Limits 159

3.10.3.2 Sonic Limits 160

3.10.3.3 Entrainment Limits 160

3.10.3.4 Boiling Limits 161

3.10.4 Wall Thickness 162