Electrical Engineering Applications -

. .

Sommaire:
1 Semiconductor Device Analysis.- 1.1 Introduction.- 1.2 The Basic Semiconductor Equations.- 1.3 Two Well Known Approximations.- 1.4 A Particular Application: The MOS Transistor.- 1.5 Some Further Applications.- 1.6 Conclusion.- References.- 2 Thermal Analysis of Semiconductor Devices.- 2.1 Introduction.- 2.2 Review of Previous Works.- 2.3 The Boundary Element Method.- 2.4 Applications.- Summary.- Acknowledgement.- References.- 3 Applications of Boundary Elements in Corrosion Engineering.- 3.1 Introduction.- 3.2 Prediction Techniques.- 3.3 Theoretical Foundations of Cathodic Protection and Galvanic Corrosion.- 3.4 Mathematical Aspects.- 3.5 Electrode Kinetics.- 3.6 Coupling of the System.- 3.7 Polarisation.- 3.8 Systems Approach.- 3.9 Example 1: Comparison of BE Results with Cathodic Protection Experiment on a Plate.- 3.10 Example 2: Cathodic Protection of Underground Pipelines.- 3.11 Example 3: Analysis of Galvanic Corrosion (A Comparison with FE Analysis).- 3.12 Example 4: Analysis of a Galvanic Corrosion Due to a Chemical Cleaning Process.- 3.13 Example 5: Analysis of a Jacket Type Offshore Platform.- 3.14 Conclusions.- Acknowledgements.- References.- 4 Application of BEM to Galvanic Corrosion and Cathodic Protection.- 4.1 Introduction.- 4.2 Electrochemical Aspects.- 4.3 Mathematical Model.- 4.4 Boundary Element Formulation.- 4.5 Iterative Solution Procedures.- 4.6 Infinite Problems.- 4.7 Applications.- 4.8 Concluding Remarks.- Acknowledgements.- References.- 5 Capacitance of Transducers for Displacement Measurement.- 5.1 Introduction.- 5.2 Calculation of Capacitance by the Boundary Element Method.- 5.3 Numerical Results.- 5.4 Experimental Results.- 5.5 Conclusions.- Acknowledgement.- References.- 6 Electroplating.- 6.1 Introduction.- 6.2 Mathematical Formulation.- 6.3 Boundary Element Formulation.- 6.4 Solution of the Nonlinear System.- 6.5 Development of a One-dimensional Model.- 6.6 Numerical Examples.- 6.7 Conclusions.- Acknowledgement.- References.- 7 Simulation of an Electrochemical Plating Process.- 7.1 Introduction.- 7.2 Equations.- 7.3 Boundary Element Method.- 7.4 Experiment.- 7.5 Results.- 7.6 Conclusions.- Acknowledgements.- References.- 8 Electrochemical Cell Design.- 8.1 Introduction.- 8.2 Fundamental Equations.- 8.3 Boundary Conditions.- 8.4 Types of Distributions, the Wagner Number.- 8.5 Electrode Shape Change and Moving Boundaries.- 8.6 Solution of the Potential Model.- 8.7 Solution of Electrode Shape Changes.- References.- 9 Inverse Problems and Some Applications.- 9.1 Introduction.- 9.2 Fields of Application of Inverse Problems.- 9.3 Application of Boundary Element Methods.- 9.4 Numerical Simulation.- 9.5 Improvement of the Boundary Determination Capability.- References.