Mechanics of Microelectronics - G. Q. Zhang

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Résumé :
From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research. Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Sommaire:
Microelectronics technology Introduction A heart of silicon In a little black box Baseline CMOS Non-CMOS options Packaging Systems Conclusions References Nomenclature Reliability practices Reliability assessment Reliability statistics Acceleration factor models Failure mechanisms Exercises Thermal Management Heat transfer basics Thermal design of assemblies Thermal design for a SQFP Heatsink design choices Conclusions / final remarks Introduction to Advanced Mechanics Stress and strain Failure criteria Fracture mechanics Finite element method Thermo-Mechanics of Integrated Circuits and Packages IC Backend and packaging processes and testing Thermo-mechanics of IC backend processes Thermo-Mechanics of packaging processes Thermo-Mechanics of coupled IC backend and packaging processes Case studies Characterization and Modeling of Moisture Behavior Moisture diffusion modeling Characterization of moisture diffusivity and saturation concentration Vapor pressure modeling Hygroscopic swelling characterization & modeling Single void Instability behavior Subjected to vapor pressure and thermal stress Interface strength characterization and modeling Characterization and Modeling of Solder Joint Reliability Analytical-empirical prognosis of the reliability Thermo-mechanical characteristics of soft solders Data evaluation and LIFE-time estimation Virtual thermo-mechanical prototyping The state-of-the-art of virtual prototyping Challenges and future perspectives Product and process inputs Tests and experiments Multi-scale mechanics Advanced simulation tools Multi-physics modeling Material and interface behavior Simulation-based optimization