ESD - The Scourge of Electronics - Hellström, Sten

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Résumé :
This book on electrostatic discharge phenomena is essentially a translation and update ofa Swedish edition from 1992. The book is intended for people working with electronic circuits and equipments, in application and development. All personnel should be aware of the ESD-hazards, especially those responsible for quality. ESD-prevention is a part of TQM (Total Quality Management). The book is also usable for courses on the subject. Background It was soon realised that the MOS-circuits (MOS=Metal Oxide Semiconductor), which appeared in the beginning of the 1960-ties were sensitive to electrostatic discharges. But a severe accident accelerated the search for materials that do not generate electric charges. In April 1964 three people were working inside a satellite at Cape Kennedy Space Center. They suddenly screamed we are burning. They died. The satellite incapsulation was covered with untreated plastics to protect against dust. When the plastics was pulled off both this and the metal incapsulating got charged. A discharge from the metal ignited inflammable parts of the satellite. Eleven more people were injured and the cost of the accident amounted to about 55 billions USD.

Sommaire:
List of contents.- 1 The Discovery of Static Electricity and Its Manifestation.- 1.1 Triboelectricity.- 1.2 The Induced Electricity (Influence).- 1.3 Charge, Potential and Field.- 2 Relation to Electronics.- 2.1 Charging.- 2.2 Direct Electric Discharges.- 2.3 Self-Charging.- 2.4 Charging by Induction (Influence).- 2.5 Rolling Gates as ESD-Generators.- 2.6 Relation Between Charging - Discharging Processes and ESD-Simulation Models.- 3 ESD-Testing and Models.- 3.1 General.- 3.2 ESD-Simulation Models.- 3.3 Comparison between Different Models and the Components' Responses to Them.- 4 Susceptibility for ESD.- 4.1 Future Implications of ESD.- 4.2 Example of Determination of Susceptibility Level.- 5 Failure Analysis.- 5.1 General.- 5.2 Failure Manifestation.- 5.3 Failure Mode.- 5.4 Technical Failure Analysis Works.- 5.5 Cause of Failure and Failure Mechanisms.- 6 Latent Failures.- 6.1 Time Dependence and Event Dependence.- 6.2 Technology Dependence.- 6.3 III-V-Components.- 6.4 Polysilicon Resistors.- 6.5 Detection of Latent Failures.- 6.6 Consequences and Counteractions.- 7 Indirect ESD.- 7.1 E- and H-Field.- 7.2 Examples of Perturbation.- 7.3 Testing Methods and Norms.- 8 Other Types of Perturbations in Electronics.- 8.1 Noise.- 8.2 Perturbation from Transients.- 8.3 EMC.- 9 The Impact of Electric Fields and Electromagnetic Waves on the Organism.- 9.1 Computer Screens, TV-Sets etc.- 9.2 Electromagnetic Radiation Fields.- 10 Simulation Methods.- 10.1 Mathematical Approach.- 10.2 Simulation of Transients Across an pn-Junction.- 10.3 2D and 3D Simulations.- 11 Protection Methods - Antistatic Materials.- 11.1 General.- 11.2 Protection Circuits in Components.- 11.3 Design Rules Against the Impact of ESD.- 11.4 Antistatic Materials.- 11.5 Evaluation Methods forAntistatic Materials.- 11.6 The Localisation of Charges.- 11.7 Protection Program.- 11.8 Norms and Standard.- 11.9 Labels for Marking.- 12 Failure Frequency and Costs for ESD.- 12.1 Failure Occurrance.- 12.2 Cost of ESD-Failures.- 13 Index.- 14 References.