Metallized Plastics 2 -

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Sommaire:
I. Metallization Techniques and Properties of Metal Deposits.- An Electrochemical Method of Polyimide Metallization.- Electroplating of Polymers, Gas Permeability and Adhesion of the Composite Materials.- Molecular Level Metal and Ceramic/Polymer Composites. Synthesis of Metal and Metal Oxide Containing Polyimides and its Relevance to Polymer Metallization.- Photolithographic Plating of Platinum and Copper on Insulating Substrates.- Metallized Indium Island Films for Flexible Automotive Trim.- Metallization of Plastics by Physical Vapor Deposition Techniques.- Ion Beam Assisted Metallization of Plastics.- Plasma Induced Deposition of Copper Films on Polymer Surfaces.- Metallization of Polytetrafluoroethylene (PTFE) by Means of Plasma-Enhanced Chemical Vapour Deposition.- Metallization of Plastics Via Low Temperature Arc Vapor Deposition (LTAVD).- Magnetron Sputtered Tin Hard Coatings on Plastics.- Diffusion and Gettering Simulations of Ion Implanted Copper in Polyimide.- II. Investigation of Interfacial Interactions.- Comparison Between the Interfacial Chemistry of Metallized Polyimides and Polyimide Films on Bulk Metal Substrates.- Chemical Interactions at Polymer-Metal Interfaces of Interest to Microelectronics.- Photoelectron Spectroscopy Model Study of the Interface Between Polyimide and Copper.- Electronic Structure of Metal/Polymer Interfaces: Aluminum on Conjugated Polymers.- Study of Chemical Interactions in Metallized Polymers Used for Microelectronic Packaging.- XPS Study of the Interface Between Thermally Evaporated Aluminium and Polyethyleneterephthalate: Evidence for Oxycarbide Species.- XPS-Study of Metal-Polymer Interfaces After Polymer Surface Treatment by Ion and Plasma Techniques.- Behavior of Metal-Polyimide Interfaces Under Degradative Ambients.- Study of Titanium/Polyimide Interface in a Reducing Environment.- III. Plastic Surface Modifications.- Ion Beam Induced Chemical Reactions at Polymer Surfaces.- Surface Pre-treatment and Metal Coating of Commercial Polyimide Studied by Surface Analytical Techniques.- Characterization of a Surface Chemically-Modified Polyimide.- Diffusion of Ions in a Surface Chemically-Modified Polyimide.- Modification of Polymer Surfaces by Dual Frequency Plasma.- Electrochemical Reduction of PMDA-ODA and Effects on Metal/Polyimide Interfacial Reliability.- IV. Adhesion Aspects of Metallized Plastics.- Sticky Polymers Through Ion Beam Processing.- Molecular Dynamic Phenomena at Polymer Surfaces and Their Relevance to Polymer Adhesion Behavior.- Enhanced Metal/Polymer Adhesion by Ion Assisted Deposition.- An Improved Process to Facilitate the Chemical Bonding of Electroless Copper to Polyetherimide Surfaces.- Adherent Electroless Copper Layers on Polystyrene.- Correlation Between Surface Chemistry of Polycarbonate and its Adhesion Behavior to Electrolessly Plated Copper.- Water-Induced Degradation of Metal/Polyimide Interfaces.- Thin Film Adhesion Measurement Using Excimer Laser Ablation and Tensile Extension Tests.- About the Contributors.