Microchip Fabrication - Zant, Peter Van

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Résumé :

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The most complete, current guide to semiconductor processing

Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.

State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.

COVERAGE INCLUDES:

• The semiconductor industry
• Properties of semiconductor materials and chemicals
• Crystal growth and silicon wafer preparation
• Wafer fabrication and packaging
• Contamination control
• Productivity and process yields
• Oxidation
• The ten-step patterning process--surface preparation to exposure...

  Biographie:
  Peter Van Zant is the Principal of Peter Van Zant Associates, a semiconductor manufacturing consulting and training company, and the author of all three previous editions of this widely read book. He has over 35 years in the semiconductor industry, working at IBM, Texas Instruments, and National Semiconductors. He resides in Grass Valley, California....

  Sommaire:
  Ch 1. The Semiconductor Industry
  Ch 2. Properties of Semiconductor Materials and Chemicals
  Ch 3. Crystal Growth and Silicon Wafer Preparation
  Ch 4. Overview of Wafer Fabrication
  Ch 5. Contamination Control
  Ch 6. Productivity and Process Yields
  Ch 7. Oxidation
  Ch 8. The Ten-Step Patterning Process--Surface Preparation to Exposure
  Ch 9. The Ten-Step Patterning Process--Developing to Final Inspection
  Ch 10. Advanced Photolithography Processes
  Ch 11. Doping
  Ch 12. Layer Deposition
  Ch 13. Metalization
  Ch 14. Process and Device Evaluation
  Ch 15. The Business of Water Fabrication
  Ch 16. Introduction to Device and Integrated Circuit Formation
  Ch 17. Introduction to Integrated Circuits
  Ch 18. Packaging
  Glossary
  Index...