Smart RF Passive Components: Novel Materials, Techniques, and Applications - Guoan Wang

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Résumé :
Presents details on smart RF passive component design and serves as a guide to the performance improving and cost-down solutions this technology offers the next generation of wireless communications. This book offers guidance on how to apply these materials and techniques to design a wide range of RF passive components.

Biographie:
Guoan Wang is an advisory engineer/scientist at the IBM Semiconductor Research and Development Center in Essex Junction, Vermont. He holds an M.S. in materials science and engineering from Zhejiang University, an M.S. in electrical engineering from Arizona State University, and a Ph.D. in electrical and computer engineering from the Georgia Institute of Technology. Bo Pan is a senior RF engineer at Realtek Semiconductor Corporation in Irvine, California. He holds an M.S. in electrical engineering from Tsinghua University and a Ph.D. in electrical and computer engineering from the Georgia Institute of Technology.

Sommaire:
Introduction; Overview of RF Passives; Liquid Crystal Polymer Based Flexible Passives; Ferrite Materials for RF Passives; RF Passives with High Aspect Ratio Enabled Material; CNT-Based Tunable or Detectable Passives; Paper-Based Green RFID; Flexible Magnetic Composites; Metamaterial-Based RF RF Passives; Micromachining Technique and On-Chip Passive Design.