Key enabling technologies for future wireless, wired, optical and satcom applications -

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Résumé :
Preface? Editors' Biography? List of Contributors? List of Figures? List of Tables? 1 B55X: A SHIFT in STMicroelectronics BiCMOS Technologies? 2 RF Technology Roadmap for 5G and 6G RF Front-end Systems? 3 Advanced Substrate Technologies for Sub-THz Era? 4 A CMOS Compatible III-V-on-300 mm Si Technology for Future High-speed Communication Systems: Challenges and Possibilities? 5 The Impact of Irradiation on DC Characteristics and Low-Frequency Noise of Advanced SiGe:C HBTs? 6 D-band Modulated Signal Generation using Photonics Techniques? 7 Decarbonizing the Electronics Industry to Achieve Net Zero (2024)? 8 Analog Multiplexing for Bandwidth and Sampling Rate Multiplication of Digital?Analog Converters in Coherent Optical Transmission Systems? 9 Challenges for 2.5D and 3D Integration of InP HBT Technology? 10 Analysis of Quasi-Coaxial Via Implemented in IC Substrate using Multiple-Scattering Method? 11 D-band Phased Array Antenna Module for 5G Backhaul? 12 Sub-THz Transceiver Design for Future Generation Mobile Communications? 13 Ka-Band GaN-on-SiC Power Amplifier for High EIRP Satellite Phased Antenna Array? 14 InP on Si Technologies for Next-Generation Optical Communication High-speed Analog Front-Ends? 15 150 nm Gallium Nitride on Silicon Carbide Technology for High-power 5G New Radio Applications? 16 Post-process Substrate Porosification for RF Applications? 17 A Multi-standard RF Bandpass Sigma-Delta ADC? 18 D-band RF Architecture for Beyond 5G Wireless Networks: Specifications, Challenges, and Key Enabling Technologies? 19 E-band and D-band VCOs: Distributed Tank Design Methodology, Bufferless Approach? 20 2.5D, 3D Assembly Technologies for RF, mmW and Sub-THz Heterogeneous Systems? 21 Heterointegration Approaches for InP-HBT Technologies for 5G Applications and Beyond? 22 RF-Heterointegration at Wafer-level and Panel-level for mmWave Applications? 23 SiGe BiCMOS & III-V Technologies Heterogeneous Integration Challenges? 24 Advanced Packaging Solutions for mmWave Applications? 25 Modular 3D mmW and THz Packaging Concepts and Technologies? 26 LDS and AMP Processes for RF Antenna in Package (AiP) Applications in the E- and D-Bands? 27 Sub-THz Antenna and Package Integration for Miniaturized Surface-Mount Device Modules? Index...

Sommaire:
This book presents the latest research roadmaps and achievements from the European ecosystem (industry, research, and academia) driving the development of future wireless, wired, optical and satcom applications utilising the mm-wave and sub-THz bands....