Printed Electronics for Smart Packaging - Wei Wu

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Résumé :

Cutting-edge information about materials, technologies, and mechanisms of printed electronics, and their applications for the smart packaging

Printed Electronics for Smart Packaging describes how and why to use printed electronic devices for application in smart packaging.

Written by a highly qualified academic, Printed Electronics for Smart Packaging covers sample topics such as:

• Applications of printed electronics, such as flexible screens, intelligent labels and packaging, interactive books and posters, and even upholstery
• Mechanisms of smart packaging, printing methods and integrated strategies, and functional inks and substrates for smart packaging
• Printed tracks for smart tags and IPES, printed optoelectronic devices and energy suppliers for smart packaging, and printed sensors and indicators
• Integrated printed electronics systems, and expert outlooks and perspectives on potential future directions for research and development in the field

A must-have resource for anyone to expand the knowledge of the latest developments for intelligent packaging, Printed Electronics for Smart Packaging is an essential read for not just related academics but also various intersecting industries and professionals due to the importance of packaging in all market sectors....

Biographie:

Author Biography xi
Preface xiii

1 Introduction of Printed Electronics and Smart Packaging 1
1.1 Introduction 1
1.2 PE Technologies 2
1.3 Flexible PE Devices 4
1.4 PE for Smart Packaging 7
1.5 Content and Structure of This Book 10

2 Mechanisms and Strategies of Smart Packaging 13
2.1 Introduction 13
2.2 Active Packaging 15
2.3 Intelligent Packaging 21
2.4 Why You Need to Use PE? 39

3 Printing Methods and Integrated Strategies 47
3.1 Introduction 47
3.2 Conductive Mechanism of Printed Electronic Inks 48
3.3 Manufactural Process of PE Devices 50
3.4 Postprinting Process 66
3.5 Techniques and Parameters for PE 70

4 Functional Inks and Substrates for Smart Packaging 83
4.1 Introduction 83
4.2 Conductive Inks and Pastes 86
4.3 Printable Semiconductors and Insulator Inks 112
4.4 Conventional Substrates for PE Devices and Smart Packaging 119

5 Printed Tracks for Smart Tags and Packaging 131
5.1 Introduction 131
5.2 Printed Tracks, Interconnected Circuits, and Printed Antennas 133
5.3 Printed Flexible Transparent Electrodes 140
5.4 Printed Stretchable Electrodes and Stretchable Interconnects 143
5.5 Printed Flexible Heaters for Self-heating Packaging 148

6 Printed Optoelectronic Devices and Energy Suppliers for Smart Packaging 161
6.1 Introduction 161
6.2 Printed Optoelectronic Devices 163
6.3 Printed Energy Devices for Smart Tags and IPES 171

7 Printed Sensors and Indicators 207
7.1 Introduction 207
7.2 Printed Force Sensors 209
7.3 Printed Temperature and Humidity Sensors 217
7.4 Printed Piezoelectric and Triboelectric Sensors 223
7.5 Printed Gas Sensors 227
7.6 Printed Time-Temperature/Gas/Freshness Indicators 232

8 Integrated Printed Electronics Systems 247
8.1 Introduction 247
8.2 Printed Multisensor Platform 253
8.3 Wireless Sensor Platforms 261
8.4 E-skin 268
8.5 Self-powered IPES 271
8.6 IPES Tags for Smart Packaging 273

9 Outlooks and Perspectives 283
9.1 Introduction 283
9.2 The Consensus of Smart Packaging 284
9.3 Printed Electronics Technology's Advantages in Manufacturing Smart Packaging Products 286
9.4 Application Scenarios-Driven Smart Packaging Implementation 287

References 289
Index 291