Printed Electronics for Smart Packaging - Wei Wu

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Résumé :

Author Biography xi

Preface xiii

1 Introduction of Printed Electronics and Smart Packaging 1

1.1 Introduction 1

1.2 PE Technologies 2

1.2.1 What Is PE Technologies? 2

1.2.2 Why Should PE Technologies Be Developed? 2

1.3 Flexible PE Devices 4

1.4 PE for Smart Packaging 7

1.4.1 Food Packaging 7

1.4.2 Drug Packaging 8

1.4.3 Smart Logistics and Supply Chain 9

1.5 Content and Structure of This Book 10

References 11

2 Mechanisms and Strategies of Smart Packaging 13

2.1 Introduction 13

2.2 Active Packaging 15

2.2.1 Moisture Regulators 15

2.2.2 Modified Atmosphere Packaging 16

2.2.3 Ethylene Scavengers 17

2.2.4 Antimicrobial Active Packaging 18

2.2.5 PCMs-Based Active Packaging 20

2.3 Intelligent Packaging 21

2.3.1 Indicator Technology for Packaging 21

2.3.1.1 Freshness Indicators 22

2.3.1.2 Time-Temperature Indicators 23

2.3.1.3 Temperature Indicators 25

2.3.2 Sensors for Smart Packaging 27

2.3.2.1 Classification and Principle of Sensors 27

2.3.2.2 The Important Characteristics of Sensor 35

2.3.3 Wireless Communication Technologies in Packaging 37

2.4 Why You Need to Use PE? 39

References 41

3 Printing Methods and Integrated Strategies 47

3.1 Introduction 47

3.2 Conductive Mechanism of Printed Electronic Inks 48

3.3 Manufactural Process of PE Devices 50

3.3.1 Screen-Printed Electronic Technologies 51

3.3.2 R2R Printed Electronic Technologies 53

3.3.2.1 RSP Technology 54

3.3.2.2 Gravure Printing Technology 55

3.3.2.3 GOP and ROP 58

3.3.2.4 Flexographic Technology 60

3.3.3 Inkjet Printed Electronic Technologies 62

3.3.3.1 The Inkjet Printing Methods 62

3.3.3.2 The Challenges of Inkjet Printing Technologies 65

3.4 Postprinting Process 66

3.4.1 Sintering for Flexible Electronics and Smart Packaging 67

3.4.2 Sintering Methods 68

3.5 Techniques and Parameters for PE 70

3.5.1 The Influence of Geometric Dimensions on PE Devices 71

3.5.2 The Influence of Patterning Design 72

3.5.3 The Impact of Geometric Dimensions and Patterning on the Manufacturing Process 73

References 74

4 Functional Inks and Substrates for Smart Packaging 83

4.1 Introduction 83

4.2 Conductive Inks and Pastes 86

4.2.1 Silver Conductive Inks 87

4.2.1.1 Commercial Ag Pastes 87

4.2.1.2 Ag Nanomaterials-Based Conductive Inks 89

4.2.1.3 Ag-Based Composite Inks 92

4.2.2 Copper Conductive Inks 94

4.2.2.1 Commercial Cu Pastes 94

4.2.2.2 Cu Nanomaterials-Based Inks 95

4.2.3 Other Metal Conductive Paste Inks 95

4.2.3.1 Bimetallic Conductive Inks 96

4.2.3.2 Liquid Metals 97

4.2.3.3 MXene 100

4.2.4 Carbon Inks and Pastes 103

4.2.4.1 CNTs-Based Conductive Inks 103

4.2.4.2 Graphene-Based Conductive Inks 104

4.2.5 Particle-Free Inks 107

4.2.6 Organic Conductive Inks 110

4.3 Printable Semiconductors and Insulator Inks 112

4.3.1 Semiconductor Inks 112

4.3.1.1 Inorganic Semiconductor Inks 112

4.3.1.2 Organic Semiconductor Inks 116

4.3.2 Insulator Inks 118

4.4 Conventional Substrates for PE Devices and Smart Packaging 119

References 121

5 Printed Tracks for Smart Tags and Packaging 131

5.1 Introduction 131

5.2 Printed Tracks, Interconnected Circuits, and Printed Antennas 133

5.2.1 Flexible Conductive Electrode and Printed Tracks 133

5.2.2 Conductive Patterns and Interconnected Cir...

Biographie:

Wei Wu is full professor of School of Physics and Technology, Wuhan University. He received the State Scientific Innovation and Pioneer Award in 2023, the 15th Bi Sheng Award of Printing Technology in 2019, the STAM Best Paper Award in 2017, and the Hong Kong Scholars Award in 2014.