LED Packaging Technologies - Annaniah, Luruthudass

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Résumé :

About the Authors vii

Preface ix

Acknowledgments xiii

1 A Brief History of Artificial Light and LED Packaging 1

1.1 Evolution in Artificial Light 1

1.2 Impact of Light-Emitting Diode on the World 4

1.3 LED Industrial Chain 6

1.4 Evolution in LED Packaging Technology 8

1.4.1 Low-Power Package Evolution 12

1.4.2 Mid-Power LED Packages 14

1.4.3 LED High-Power and Ultra-High-Power Packages 15

1.5 Summary 17

References 18

2 Fundamentals of LED Packaging Technology 19

2.1 Effective Light Extraction 19

2.1.1 Theory of Light Conversion in LED 21

2.1.2 Light Extraction Based on Chip Technology 23

2.1.2.1 Chip Surface Roughing 25

2.1.2.2 Buried Micro-Reflectors Chip 26

2.1.2.3 Chip Geometrical Shaping and Type 26

2.1.3 Light Extraction Based on High Reflective Packaging Material 28

2.1.3.1 Leadframe Plating Surface Influence 28

2.1.3.2 Housing Material Reflectivity 29

2.1.3.3 Encapsulation Material Light Extraction Efficacy 29

2.1.4 Optical Interface Enhancing Light Extraction 31

2.2 Package Design and Encapsulation Technology 32

2.2.1 Package Design 32

2.2.1.1 Design for Cost 33

2.2.1.2 Design for Reliability 34

2.2.1.3 Design for Manufacturing 34

2.2.1.4 Design for Testing 34

2.2.1.5 Design for Environment 36

2.2.1.6 Design for Assembly at Second Level PCB Board 36

2.2.1.7 Design for Effective Light Extraction 37

2.2.2 Encapsulation of LED 37

2.2.2.1 Epoxy, Silicone, and Hybrid Compound Encapsulation 37

2.2.2.2 Hermetic Sealed Package - Metal Can 40

2.2.2.3 Epoxy Cap Encapsulation 41

2.2.2.4 Glass Cap on Ceramic or Aluminum Encapsulation 41

2.3 LED Thermal Management 42

2.3.1 Fundamental of the LED Thermal Behaviors 42

2.3.2 Thermal Design in LED Package 46

2.3.3 Impact of Thermal Behavior of an LED on Its Performance 48

2.4 Electrical Contact Design 49

2.5 LED Light Conversion Principle 50

2.6 Summary 50

References 51

3 LED Packaging Manufacturing Technology 53

3.1 LED Packaging Process Flow 53

3.1.1 Die-Attach Process 53

3.1.1.1 Die-Attach and Glue Curing Process 55

3.1.2 Wire Bonding Process 56

3.1.3 Surveillance Checking Using Statistical Process Control 58

3.1.4 Encapsulation Process and Post-Mold Curing Process 60

3.1.5 Singulation Process 62

3.1.6 Final Test and Auto Vision System Process 62

3.1.7 Packing Process 63

3.2 Common Defects in LED Packaging Industry 65

3.2.1 Die-crack: Impact on the Electrical and Optical Properties of LED 65

3.2.2 Lifted Die or Glue: Impact on LED Thermal Behavior and LED Performance 67

3.2.3 Wire Interconnect Defects: Impact on LED Electro-optical Quality 69

3.3 Summary 70

References 70

4 LED Automotive Lighting Application Technology 71

4.1 Basic Science of Light for Automotive - The Photometric 72

4.1.1 Light Intensity 72

4.1.2 Luminous Flux 73

4.1.3 Illuminance 74

4.1.4 Luminance 74

4.1.5 Luminous Efficacy 74

4.2 Lighting - Light Projection To See 74

4.2.1 Headlamp 75

4.2.2 Adaptive Front-Lighting System - Headlamp 77

4.2.3 Optical Concept Automotive Front Lighting - Headlamp 80

4.2.4 Future of LED Headlamp Technology 81

4.2.5 LED Headlamp Thermal Management 82

4.3 Signaling - Lights That Are To Be Seen 83

4.3.1 AFL - Day Running Light 84

4.3.2 ARL - Signaling Lights 85

4.3.3 Optic Concepts of Signaling Light To Be Seen 86...

Biographie:
Professor Rajan Jose is the supervisor of the Nanostructured Renewable Energy Materials Laboratory at the University Malaysia Pahang (UMP). He received his doctoral research from the Council of Scientific and Industrial Research (CSIR), Trivandrum, India, for his research on nanostructured perovskite ceramics for microwave and superconducting electronics. Before joining UMP, he worked as scientist at the Indira Gandhi Centre for Atomic Research (India), AIST (Japan), Toyota Technological Institute (Japan), and the National University of Singapore (Singapore). He has contributed to the science and engineering of diverse range of materials including metals and alloys, luminescent quantum dots for biological and energy applications, glass and glass ceramics for quantum electronics, and electrochemical materials for energy conversion and storage. He has published over 200 journal articles with over 9500 citation and an h-index of 51. He holds 25 patents nationally and internationally. His current research interests include nanostructured materials and renewable energy devices...

Sommaire:
A Brief History of Artificial Light and LED Packaging
Fundamentals of LED Packaging Technology
LED Packaging Manufacturing Technology
LED Automotive Lighting Application Technology
LED Application for Consumer Industry
LED Application for General Lighting
Quantum LED
Ultraviolet (UV) LED Packaging and Application
Lifecycle Analysis and Circular Economy of LEDs...